WG Tech Demos Vias in Glass Substrates for MicroLEDs

WG Tech can fabricate vias in glass to facilitate microLED production. A pure laser via process cracks the glass, so they use a laser to make a pit, then etch the via. This capability is especially important for seamless tiling of glass-based microLED panels into modules and display systems. That’s because interconnection from the front plane to driver chips on the back of the display requires routing connectors over the edge of the glass substrate. While this works, it is very prone to damage. A via would mean no edge metalization reducing costs and increasing reliability.

Chris Chinnock for Insight Media at DisplayWeek 24. I’m in a company’s booth called WG Tech. They have a very interesting development for the microLED space. So, one of the issues for microLED fabrication that can’t be done right now is doing vias in glass substrates. If you want to do vias for all the complex metalizations, that can only be done in PCBs right now. And there’s a limit to the pixel pitch that you can get with PCBs. It’s about a half a millimeter so if you want to go below that you’ve got to go to glass. But you can’t do vias until today.

So what they are showing is a very thin sheet of glass which is obviously very difficult to photograph. But what this is, according to these specifications, I think this was about 150-micron thickness as I recall he said. And it’s got a whole bunch of vias that go through this thing here that are 250 microns in size. Actually, the vias they say can be made all the way down to 10 microns with metalization. They’re showing metalization on both sides here as well. They have a project to do vias on 50-micron thick glass.

So, this is really important, and the flatness of the glass is also really important as you can do very good bonding for your mass production process. That’s one of the problems in PCBs. They’re not that flat so you can get yield issues. Now if you can put it on glass, you just increase yields. This can be done to do these kinds of packaged devices too, so multiple microLEDs and a package. Again, this has traditionally had to been done on PCB. Now you can do this in glass. They’re working on a number of other things so yeah actually here’s their demo here. This is microLEDs in package on a board so these are then demonstrated on this board right here. I’m sure there’s a lot more to learn here but that’s about all I got for today.  Chris Chinnock here for Insight Media.

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