Table of Contents
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Overview / Introduction
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Executive Summary
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Reverse Costing Methodology
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Texas Instruments Company Profile
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Physical Analysis
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Synthesis of the Physical Analysis
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DLP® 0.17 HVGA: Package Characteristics
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DLP® 0.17 HVGA: Package Opening
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DLP® 0.17 HVGA: Package Cross Section
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DLP® 0.17 HVGA: Process technology
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DLP® 0.17 HVGA: Micromirrors-Pictures
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DLP® 0.3 WVGA: Package Characteristics
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DLP® 0.3 WVGA: Package Opening
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DLP® 0.3 WVGA: Package Cross Section
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DLP® 0.3 WVGA: Process technology
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DLP® 0.3 WVGA: Micromirrors-Pictures
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DLP® nHD: Package Characteristics
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DLP® nHD: Package Opening
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DLP® nHD: Package Cross Section
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DLP® nHD: Process technology
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DLP® nHD: Micromirrors-Pictures
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Manufacturing Process Flow
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Wafers Fabrication Units
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Front-End Manufacturing Process Flow:
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Back-End Packaging Process Flow
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Back-End Packaging Assembly Unit
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Cost Analysis
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Synthesis of the Cost Analysis
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CMOS Wafer Front-End Cost
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CMOS Die Cost
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MEMS Wafer Front-End Cost
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MEMS Front-End Cost per Steps
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MEMS Front-End Cost per Equipment
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MEMS Front-End Cost per Consumables
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MEMS Die Cost
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Back-End : Package Cost
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Back-End : Package Cost Per Steps
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Manufacturing Cost
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Estimated Manufacturer Price
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Glossary
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Conclusion
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