At DisplayWeek 2024, Chris Chinnock of Insight Media detailed several microLED advancements from VueReal, specifically focusing on their proprietary “Solid Printing” transfer technology and diverse display architectures.

Small Passive Matrix Devices

• Specifications: 0.4-inch diagonal, 160×120 resolution, with a 35-micron pixel pitch.
• Technology: Uses 28×15 micron flip-chip devices available in discrete red, green, and blue.
• Applications: Designed for “information snacking” and wearable tech like sports goggles.

Transparent & Active-Matrix Displays

• The “Tier 1” Demo: A transparent active-matrix display (LTPS on glass) featuring 80% transparency and 172 PPI. This unit was previously showcased by a major OEM at CES.
• High-Brightness Potential: While current passive matrix versions hit around 300–1,500 nits, a new backplane in development is expected to reach 5,000 nits.

Vertical MicroLEDs (2-Micron Emitters)

VueReal is pushing the limits of miniaturization with 2-micron vertical microLEDs.

• Why Vertical? At such a small scale, traditional flip-chip mounting (where both contacts are on the bottom) becomes technically difficult. Vertical chips use one contact on top and one on the bottom.
• Trade-off: Vertical chips require additional post-processing for top-layer metalization, which can slightly impact light emission surface area compared to flip-chips.

Patented AR Combiner Architecture

VueReal is proposing a unique architecture for AR applications that mirrors a DLP engine combiner:

• Instead of using simple LEDs as a light source for a separate imager, they use individual microLED imagers (Red, Green, and Blue).
• These are merged through a combiner to create a compact, full-color display.
• This system is modular, allowing for additional colors (like cyan or deep blue) or sensors to be integrated directly into the optical path.