DLP PICO PROJECTORS FAMILY PHYSICAL & COST ANALYSIS ~ DLP NHD, DLP 0.3 WVGA, DLP 0.17 HVGA – TOC

Table of Contents

Overview / Introduction
Executive Summary
Reverse  Costing  Methodology
Texas Instruments Company Profile
Physical Analysis
Synthesis of the Physical Analysis
DLP® 0.17 HVGA: Package Characteristics
DLP® 0.17 HVGA: Package Opening
DLP® 0.17 HVGA: Package Cross Section
DLP® 0.17 HVGA: Process  technology
DLP® 0.17 HVGA: Micromirrors-Pictures
DLP® 0.3 WVGA:  Package Characteristics
DLP® 0.3 WVGA:  Package Opening
DLP® 0.3 WVGA:  Package Cross Section
DLP® 0.3 WVGA:  Process  technology
DLP® 0.3 WVGA:  Micromirrors-Pictures
DLP® nHD:  Package Characteristics
DLP® nHD: Package Opening
DLP® nHD:  Package Cross Section
DLP® nHD:  Process  technology
DLP® nHD: Micromirrors-Pictures
Manufacturing Process Flow
Wafers Fabrication Units
Front-End  Manufacturing Process Flow:
Back-End Packaging Process Flow
Back-End Packaging Assembly Unit
Cost Analysis
Synthesis of the Cost  Analysis
CMOS Wafer Front-End Cost
CMOS Die Cost
MEMS  Wafer Front-End Cost
MEMS Front-End Cost per Steps
MEMS Front-End Cost per Equipment
MEMS Front-End Cost per Consumables
MEMS Die Cost
Back-End : Package Cost
Back-End : Package Cost Per Steps
Manufacturing Cost
Estimated Manufacturer Price
Glossary
Conclusion